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For general support, send an email to [email protected]

Process Capabilities & Services

The table below summarises the main fabrication process capabilities available to customers for photolithography, etching, deposition and oxidation, bonding and glass packaging. A PDF version of this matrix is available for download from our Downloads Library.  We also offer our Foundry Design Rules as a downloadable document here and in our download library.

Process Process Specification Notes Wafer Size (фmm)
100 125 150 200
Photolithography Resist Coat

Thickness: 10.0µm (max)

Also available - resist coating to a substrate having a spray coat process step

Y Y Y Y
Uniformity: +/-5% Y Y Y N
Exposure Mirror Projection Aligner Line/Space: 1.5µm (min)   Y Y Y N
Contact Aligner Line/Space: 3.0µm (min) Also available - top and bottom side alignment of the wafer Y Y Y N
Stepper Line/Space: 1.0µm (min)   N Y Y Y
Develop   Also available - photolithography development service Y Y Y Y
Etching Si Deep Etch Line/Space: 1.0µm (min)
 
    Y Y Y Y
Hole diameter: ф2.0µm (min)
Aspect ratio: 1:100 (max)
Dry Etch (Metal, PZT, Resist) Line/Space: 3.0µm (min)   Y Y Y Y
Dry Etch (SiO2, SiC) Line/Space: 1.0uµm (min)   Y Y Y Y
Vapor HF Line/Space: 1.0µm (min)   Y Y Y Y
Wet Etch   Au, Al, Ti, Cr, etc Y Y Y N
Thin Film Deposition PZT Sputter Relative permittivity (εr): 900   Y Y Y Y
Piezoelectroc Constant (d31): 220pm/V
Metal Sputter Thickness: 10.0nm ∼ 2.0µm Au, Pt, Al, Ti, Cr, etc Y Y Y N
Uniformity: +/- 10%
SiO2 Sputter Thickness: 2.0µm (max)   Y Y Y N
Uniformity: +/- 10%
Plasma Deposition PE-CVD SiO2 (TEOS) Thickness: 10.0µm ∼ 5.0µm   Y Y Y Y
Uniformity: +/- 5%
PE-CVN SiN Thickness: 10.0um ∼ 5.0µm Stress can be controlled Y Y Y Y
Uniformity: +/- 5%
 Furnace Thermal Oxidation   Wet/dry mixed Y Y Y Y
Annealing     Y Y Y Y
Wafer Bonding Anodic bonding Available Vacuum Control: > 0.01Pa   Y Y Y Y
Glass Process Sand Blast Line/Space: 15µm (min)   Y Y Y N
Hole diameter: ф50µm
Wet Etch Line/Space: 10µm (min)   Y Y Y N
Depth: 300µm (max)
Back End Automated Dicing     Y Y Y Y
Back Grinding     N Y Y Y
Metrology SEM     Y Y Y Y
Inspection Microscope    
Surface Profiler    
Sheet Resistance (4-point probe)    
CNC Vision Measuring System    
Zygo    
XRF    
EDX    
Laser Microscope    

A PDF version of this matrix is available for download from our Downloads Library.

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