Process Capabilities & Services

The table below summarises the main fabrication process capabilities available to customers for photolithography, etching, deposition and oxidation, bonding and glass packaging. A PDF version of this matrix is available for download here and from our Downloads Library.  We also offer our Foundry Design Rules as a downloadable document here and in our download library.

Process		Specification	Notes	Availability by Wafer Size (фmm)
				100	125	150	200
Photolithography	Resist Coat	Thickness: 10.0µm (max) Uniformity: +/-5%	Also available: Spray Coat to a substrate having a step	Y	Y	Y	Y
	Exposure Mirror Projection Aligner	Line/Space: 1.5µm (min)		Y	Y	Y	N
	Contact Aligner	Line/Space: 3.0µm (min)	Also available - top and bottom side alignment of the wafer	Y	Y	Y	Y
	Stepper	Line/Space: 1.0µm (min)		N	Y	Y	Y
	Develop		Photolithography development service available	Y	Y	Y	Y
Etching	Si Deep Etch	Line/Space: 1.0µm (min)		Y	Y	Y	Y
		Hole diameter: ф2.0µm (min)
		Aspect Ratio: 1:100 (max)
	Dry Etch	Line/Space: 3.0µm (min)	Metal, PZT, Resist	Y	Y	Y	Y
	Vapor HF	Line/Space: 1.0µm (min)		Y	Y	Y	Y
	Wet Etch		Au, Al, Ti, Cr, etc	Y	Y	Y	Y
Thin Film Deposition	PZT Sputter	Relative Permittivity (εr): 900		Y	Y	Y	Y
		Piezoelectric Constant (d31): 220pm/V
	Metal Sputter	Thickness: 10.0nm ~ 2.0µm Uniformity: +/- 10%	Au, Pt, Al, Ti, Cr, etc	Y	Y	Y	Y
	SiO2 Sputter	Thickness: 2.0µm (max) Uniformity: +/- 10%		Y	Y	Y	Y
Plasma Deposition	PE-CVD SiO2 (TEOS)	Thickness: 10.0nm ~ 5.0µm Uniformity: +/- 5%		Y	Y	Y	Y
	PE-CVN SiN	Thickness: 10.0nm ~ 5.0µm Uniformity: +/- 5%	Stress can be controlled	Y	Y	Y	Y
Furnace	Thermal Oxidation		Wet/dry mixed	Y	Y	Y	Y
	Annealing			Y	Y	Y	Y
Wafer Bonding	Anodic bonding	Available Vacuum Control: >0.01Pa		Y	Y	Y	N
Glass Process	Sand Blast	Line/Space: 15.0µm (min)		Y	Y	Y	N
		Hole diameter: ф50.0µm
	Wet Etch	Line/Space: 10.0µm (min)		Y	Y	Y	N
		Depth: 300µm (max)
Back End	Automated Dicing			Y	Y	Y	Y
	Back Grinding			N	Y	Y	Y
Metrology	SEM			Y	Y	Y	Y
	Inspection Microscope
	Surface Profiler
	Sheet Resistance (4-Point Probe)
	CNC Vision Measuring System
	Zygo
	XRF
	EDX
	Laser Microscope