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Office Hours

Mon-Fri 8:00AM - 5:00PM
For general support, send an email to [email protected]

Process Capabilities & Services

The table below summarises the main fabrication process capabilities available to customers for photolithography, etching, deposition and oxidation, bonding and glass packaging. A PDF version of this matrix is available for download here and from our Downloads Library.  We also offer our Foundry Design Rules as a downloadable document here and in our download library.

ProcessSpecificationNotesAvailability by Wafer Size (фmm)
100125150200
PhotolithographyResist CoatThickness: 10.0µm (max)
Uniformity: +/-5%
Also available: Spray Coat to a substrate having a stepYYYY
Exposure Mirror Projection AlignerLine/Space: 1.5µm (min)YYYN
Contact AlignerLine/Space: 3.0µm (min)Also available - top and bottom side alignment of the waferYYYY
StepperLine/Space: 1.0µm (min)NYYY
DevelopPhotolithography development service availableYYYY
EtchingSi Deep EtchLine/Space: 1.0µm (min)YYYY
Hole diameter: ф2.0µm (min)
Aspect Ratio: 1:100 (max)
Dry EtchLine/Space: 3.0µm (min)Metal, PZT, ResistYYYY
Vapor HFLine/Space: 1.0µm (min)YYYY
Wet EtchAu, Al, Ti, Cr, etcYYYY
Thin Film DepositionPZT SputterRelative Permittivity (εr): 900YYYY
Piezoelectric Constant (d31): 220pm/V
Metal SputterThickness: 10.0nm ~ 2.0µm
Uniformity: +/- 10%
Au, Pt, Al, Ti, Cr, etcYYYY
SiO2 SputterThickness: 2.0µm (max)
Uniformity: +/- 10%
YYYY
Plasma DepositionPE-CVD SiO2 (TEOS)Thickness: 10.0nm ~ 5.0µm
Uniformity: +/- 5%
YYYY
PE-CVN SiNThickness: 10.0nm ~ 5.0µm
Uniformity: +/- 5%
Stress can be controlledYYYY
FurnaceThermal OxidationWet/dry mixedYYYY
AnnealingYYYY
Wafer BondingAnodic bondingAvailable Vacuum Control: >0.01PaYYYN
Glass ProcessSand BlastLine/Space: 15.0µm (min)YYYN
Hole diameter: ф50.0µm
Wet EtchLine/Space: 10.0µm (min)YYYN
Depth: 300µm (max)
Back EndAutomated DicingYYYY
Back GrindingNYYY
MetrologySEMYYYY
Inspection Microscope
Surface Profiler
Sheet Resistance (4-Point Probe)
CNC Vision Measuring System
Zygo
XRF
EDX
Laser Microscope

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